The International Conference on Tribology in Manufacturing Processes (ICTMP) & Advanced Surface Engineering aims to bring together researchers, academic professionals, and industry experts to share knowledge and discuss the latest advancements in tribology as it relates to manufacturing processes, joining techniques, functional surfaces, and advanced (nano/bio) tribology. The conference will explore innovative approaches, technologies, and materials concerning lubrication, coatings, surface engineering, and friction reduction. It will cover fundamental research and practical applications across various industries, fostering collaboration and disseminating knowledge in the field of tribology. ICTMP 2026 will be held from July 22 to 24, 2026, at Arnoma Grand Bangkok, Thailand.

Submission Guidelines

All papers must be original and not simultaneously submitted to another journal or conference. Only full papers (5-8 pages) are welcome; the template can be downloaded here.

Scope

• Advanced Lubricants and Lubrication Techniques
• Surface Engineering and Coatings
• Friction, Wear, and Contact Mechanics
• Joining Technologies and Tribology
• Tribology in Additive Manufacturing
• Tribology in Machining and Forming Processes
• Modeling, Simulation, and Experimental Techniques
• Industrial Applications and Case Studies
• Environmentally Friendly Tribological Solutions and Other Topics Related to Tribological Phenomena

Committees

Conference Chairs

• Chair: Kuniaki Dohda (Northwestern University, USA)
• Co-Chair: Steven R. Schmid (UNC Charlotte, USA)
• Host Committee Chair: Numpon Mahayotsanun (King Mongkut’s University of Technology North Bangkok, Thailand)
• Host Committee Co-Chair: Peerawatt Nunthavarawong (King Mongkut’s University of Technology North Bangkok, Thailand)

Executive Committee

• Tatsuhiko Aizawa (Shibaura Institute of Technology, Japan)
• Laurent Dubar (Polytechnic University Hauts de France, France)
• Kuniaki Dohda (Northwestern University, USA)
• Peter Groche (Technical University of Darmstadt, Germany)
• Kunio Hayakawa (Shizuoka University, Japan)
• Chengliang Hu (Shanghai Jiao Tong University, China)
• Kazuhiko Kitamura (Nagoya Institute of Technology, Japan)
• Numpon Mahayotsanun (King Mongkut’s University of Technology North Bangkok, Thailand)
• Ryo Matsumoto (Osaka University, Japan)
• Takashi Matsumura (Tokyo Denki University, Japan)
• Pierre Montmitonnet (MINES Paris Tech, France)
• Gracious Ngaile (North Carolina State University, USA)
• Chris Valentin Nielsen (Technical University of Denmark, Denmark)
• Steven R. Schmid (UNC Charlotte, USA)
• Sathyan Subbiah (Indian Institute of Technology Madras, India)
• Zhigang Wang (Gihu University, Japan)

Publication

ICTMP 2026 proceedings will be published in EPiC Series in Engineering. Authors of selected high-quality works from the conference will be invited to submit extended versions of their original papers (50% expansion of the conference paper content) to the Journal of Bio- and Tribo-Corrosion and the Journal of Engineering.

Contact

All questions about submissions should be emailed to ictmp2026@mtec.or.th.